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Inaugural Annual International Conference of the IEEE Technology and Engineering Management Society

  • 1.  Inaugural Annual International Conference of the IEEE Technology and Engineering Management Society

    Posted 12-22-2016 10:28
    Dear Colleagues,

     

    I am glad to share with you that the Inaugural Annual International Conference of the IEEE Technology and Engineering Management Society - 2017 IEEE TEMSCON (temscon.org) is accepting paper submissions. The theme for this year is Innovation and Technology Management in the Entrepreneurial Era – Moving Technical Ideas to Market. We also plan to have a special issue of IEEE Transactions on Engineering Management journal (SSCI indexed) for qualified conference papers. The paper submission deadline is December 31, 2016.

     

    I particularly hope you or your colleagues can consider submitting papers for the conference track of Entrepreneurship and its Ecosystem. The conference will be held in Silicon Valley (Santa Clara), California from June 8-10, 2017. We are planning on starting the 8th and 9th with industry speakers from companies such as Facebook, Intel, and Uber to address challenges of technology management in their companies. More keynote speaker information to come after further confirmation. This event is connected to the IEEE Tech Industry Summit 2017 http://techindustrysummit.org/.

     

    Please find the CFP below:

     

    Sincerely, 

     

    Yanli Zhang

    Associate Professor

    Feliciano School of Business

    Montclair State University


              Call for Papers

            2017 International Conference of the IEEE Technology and Engineering Management Society

     

    TEMSCON 2017

    Hilton Santa Clara

    Silicon Valley (Santa Clara), California USA

    June 8-10, 2017

    Innovation and technology management in the entrepreneurial era

    Moving Technical Idea to Market

     

    We invite contributions from researchers, educators, managers and students. Contributions may be conceptual, theoretical, or empirical. They should document research activities, case studies or best practices, shedding light on the theory or practice of engineering, technology, or innovation management, and addressing the strategic objectives of technological change.

     

    There will be an opportunity to publish in a Special Issue of our journal IEEE Transactions on Engineering Management for selected papers submitted to the conference.

     

    Major topic areas include:

    ·       Entrepreneurship and its ecosystem 

    ·       Management of innovation 

    ·       Technology management 

    ·       Engineering management 

    ·       Strategy and global markets

    ·       New manufacturing and supply chain systems 

    ·       Information Technology and the Internet 

    ·       Biotech and healthcare innovations  

    ·       Social issues and sustainability 

    ·       People and organizations    

     

    In addition to these core topics, we have special sessions on management during these challenging times as seen by IEEE societies. For topic details, see our web at www.temscon.org.  In addition we will be hosting:

     

    Education programs in Technology and Engineering Management

    Editor's Panel – publication outlets in Technology and Engineering Management

    This event is connected to the IEEE Tech Industry Summit 2017 http://techindustrysummit.org/.

     

    Important Dates:        

    ·       Paper Submission Due:  31 December 2016

    ·       Notification of Acceptance:  15 February 2017

    ·       Author Registration Due:  30 March 2017

    ·       Normal Registration/Hotel Block Deadline: 1 May 2017 

    ·       Late Registration Begins: 15 May 2017

     

    Organizing Committee:

    General Co-Chairs: Michael Condry (TEMS President-Elect), Robert Bierwolf (TEMS VP Conferences)

    Program Co-Chairs: Xiaohong "Iris" Quan (San Jose State), Rajiv Sabherwal (Univ. of Arkansas, IEEE TEM Editor-in-Chief)

    Treasurer: Richard Stallkamp (Tekmos, Inc.), Dilip Kotak (TEMS Treasurer)

     

    For additional information, visit the conference Web page at http://www.temscon.org



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